MK107 [TAIYO YUDEN]

Please read this notice before using the TAIYO YUDEN products;


型号：	MK107
厂家：	TAIYO YUDEN (U.S.A.), INC
描述：	Please read this notice before using the TAIYO YUDEN products
文件：	总19页 (文件大小：626K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Notice for TAIYO YUDEN productsꢀ

Please read this notice before using the TAIYO YUDEN products.

REMINDERS

■ Product information in this catalog is as of October 2012. All of the contents speciﬁed herein are subject to change

without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-

fore practical application or usage of the Products.

Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-

rating such products, which are caused under the conditions other than those speciﬁed in this catalog or individual

speciﬁcation.

■ Please contact Taiyo Yuden Co., Ltd. for further details of product speciﬁcations as the individual speciﬁcation is

available.

■ Please conduct validation and veriﬁcation of products in actual condition of mounting and operating environment

before commercial shipment of the equipment.

■ All electronic components or functional modules listed in this catalog are developed, designed and intended for

use in general electronics equipment.(for AV, office automation, household, office supply, information service,

telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any

equipment in the ﬁeld such as transportation,( automotive control, train control, ship control), transportation signal,

disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have

direct inﬂuence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.

Do not incorporate the products into any equipment in ﬁelds such as aerospace, aviation, nuclear control, subma-

rine system, military, etc. where higher safety and reliability are especially required.

In addition, even electronic components or functional modules that are used for the general electronic equipment,

if the equipment or the electric circuit require high safety or reliability function or performances, a sufﬁcient reliabil-

ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to

install a protective circuit is strongly recommended at customer's design stage.

■ The contents of this catalog are applicable to the products which are purchased from our sales ofﬁces or distribu-

tors (so called“TAIYO YUDEN’s ofﬁcial sales channel”).

It is only applicable to the products purchased from any of TAIYO YUDEN’s ofﬁcial sales channel.

■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-

cur in connection with a third party's intellectual property rights and other related rights arising from your usage of

products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.

■ Caution for export

Certain items in this catalog may require speciﬁc procedures for export according to“Foreign Exchange and For-

eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.

Should you have any question or inquiry on this matter, please contact our sales staff.

MULTILAYER CERAMIC CAPACITORS

WAVE

REFLOW

■PARTS NUMBER

△＝Blank space

△

⑤

－

⑩

△

⑫

①

②

③

④

⑥

⑦

⑧

⑨

⑪

①Rated voltage

③End termination

Code

Rated voltage［VDC］

Code

End termination

2.5

Plated

High Reliability Application

6.3

④Dimension（L×W）

Type

Dimensions

EIA（inch）

（L×W）［mm］

0.4×0.2

042

063

01005

0201

0402

0204

0603

0306

0805

0508

1206

1210

1812

0.6×0.3

1.0×0.5

100

250

630

105

107

212

0.52×1.0 ※

1.6×0.8

0.8×1.6 ※

2.0×1.25

1.25×2.0 ※

3.2×1.6

②Series name

Code

Series name

316

325

432

Multilayer ceramic capacitor

3.2×2.5

Multilayer ceramic capacitor for high frequency

LW reverse type multilayer capacitor

4.5×3.2

Note : ※LW reverse type（□WK） only

⑤Dimension tolerance

Code

△

Type

ALL

063

L［mm］

W［mm］

T［mm］

Standard

0.6±0.05

1.0±0.10

0.3±0.05

0.5±0.10

105

0.5±0.10

107

1.6＋0.15/－0.05

0.8＋0.15/－0.05

0.45±0.05

212

2.0＋0.15/－0.05

1.25＋0.15/－0.05

1.25±0.20

0.85±0.10

1.25＋0.15/－0.05

0.85±0.10

316

3.2±0.20

1.6±0.20

325

105

3.2±0.30

2.5±0.30

1.0＋0.15/－0.05

0.5＋0.15/－0.05

0.45±0.05

107

212

1.6＋0.20/－0

2.0＋0.20/－0

0.8＋0.20/－0

1.25＋0.20/－0

0.8＋0.20/－0

0.85±0.10

1.25＋0.20/－0

1.6±0.30

316

105

3.2±0.30

1.6±0.30

1.0＋0.20/－0

0.5＋0.20/－0

Note: P.6 Standard external dimensions

△= Blank space

⑥Temperature characteristics code

■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAP^TM））

Applicable

standard

Temperature

range［℃］

Capacitance

tolerance

±10％

Tolerance

Code

Ref. Temp.［℃］

Capacitance change

±10％

code

JIS

－25～＋ 85

－55～＋ 85

－55～＋125

－55～＋105

－55～＋125

－55～＋ 85

±20％

±10％

EIA

X5R

X7R

X6S

X7S

X5R

±15％

±20％

±10％

±15％

±20％

±10％

±22％

±20％

±10％

±22％

±20％

±10％

LD(※)

△F

±15％

±20％

JIS

EIA

－25～＋ 85

－30～＋ 85

＋30/－80％

＋22－82％

＋80/－20％

Y5V

Note : ※.LD Low distortion high value multilayer ceramic capacitor

△= Blank space

▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspeciﬁcationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspeciﬁcation.ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■Temperature compensating type

Applicable

Temperature

range［℃］

Capacitance

tolerance

±0.1pF

±0.25pF

±0.5pF

1pF

Tolerance

Code

Ref. Temp.［℃］

Capacitance change

0±60ppm/℃

standard

code

JIS

EIA

－55～＋125

C0H

±5％

±10％

JIS

EIA

JIS

EIA

JIS

C0J

－55～＋125

0±120ppm/℃

0±250ppm/℃

±0.25pF

C0J

±0.25pF

±0.5pF

±5％

－55～＋125

－750±120ppm/℃

EIA

U2J

JIS

EIA

JIS

U2K

－55～＋125

－750±250ppm/℃

±0.5pF

±5％

+350～－1000ppm/℃

⑥Series code

（Super low distortion multilayer ceramic capacitor（CFCAP^TM）only）

⑨Thickness

Code

Thickness［mm］

0.2

Code

Series code

Standard

0.2(Temperature compensating of 042type)

0.3

0.45

0.5

⑦Nominal capacitance

Code

Nominal capacitance

（example）

0R5

0.5pF

1pF

010

0.8

100

10pF

0.85(212type or more)

101

100p

1.15

1.25

1.5

102

1,000pF

10,000pF

0.1μF

1.0μF

10μF

100μF

103

104

1.6

105

1.9

106

2.0 max

2.5

107

Note : R＝Decimal point

⑩Special code

⑧Capacitance tolerance

Code

－

Special code

Standard

Code

Capacitance tolerance

±0.1pF

MLCC for Industrial, Automotive Comfort

and Safety

±0.25pF

±0.5pF

±1pF

⑪Packaging

±5％

Code

Packaging

±10％

φ178mm Taping （2mm pitch）

±20％

φ178mm Taping （4mm pitch）

＋80/－20％

φ178mm Taping （4mm pitch, 1000 pcs/reel）

325 type（Thickness code M）

φ178mm Taping（1mm pitch）042type only

⑫Internal code

Code

△

Internal code

Standard

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■STANDARD EXTERNAL DIMENSIONS

Dimension [mm]

Type( EIA )

□MK042（01005）

□MK063（0201）

Ｌ

Ｗ

0.4±0.02

0.2±0.02

0.3±0.03

0.1±0.03

0.6±0.03

1.0±0.05

0.3±0.03

0.5±0.05

0.15±0.05

0.25±0.10

0.2±0.02

0.3±0.03

0.5±0.05

0.3±0.05

0.45±0.05

0.8±0.10

0.5±0.05

0.45±0.05

0.85±0.10

1.25±0.10

0.85±0.1

0.85±0.10

1.15±0.10

1.25±0.10

1.6±0.20

0.85±0.10

1.15±0.10

1.5±0.10

1.9±0.20

1.9+0.1/-0.2

2.5±0.20

1.9±0.20

2.5±0.20

□MK105（0402）

□VK105（0402）

1.0±0.05

0.5±0.05

1.0±0.05

0.25±0.10

0.18±0.08

□WK105（0204）※

0.52±0.05

□MK107（0603）

1.6±0.10

0.8±0.10

0.35±0.25

Ａ

Ｖ

□MR107（0603）

1.6±0.10

0.8±0.10

1.6±0.10

0.1～0.6

□WK107（0306）※

0.25±0.15

□MK212（0805）

2.0±0.10

1.25±0.10

Ｇ

Ｄ

Ｆ

0.5±0.25

※ LW reverse type

□MR212（0805）

2.0±0.10

1.25±0.10

2.0±0.15

0.25～0.75

0.3±0.2

□WK212（0508）※

1.25±0.15

□MK316（1206）

□MR316（1206）

3.2±0.15

1.6±0.15

0.5+0.35/-0.25

0.25～0.85

Ｌ

□MK325（1210）

3.2±0.30

2.5±0.20

0.6±0.3

□MR325（1210）

□MK432（1812）

3.2±0.30

4.5±0.40

2.5±0.20

3.2±0.30

0.3～0.9

0.9±0.6

Note : ※. LW reverse type, *1.Thickness code

■STANDARD QUANTITY

Dimension

Standard quantity［pcs］

Type

042

EIA（inch）

01005

［ｍｍ］

0.2

Code

Paper tape

Embossed tape

－

40000

063

0201

0402

0.3

15000

－

0.2

0.3

20000

15000

－

105

0.5

10000

－

0204 ※

0603

0.30

0.45

0.8

4000

－

4000

－

107

212

0306 ※

0.50

0.45

0.85

1.25

0.85

1.15

1.25

1.6

4000

0805

－

3000

－

0508 ※

4000

－

316

1206

－

3000

2000

0.85

1.15

1.5

－

2000

325

432

1210

1812

1.9

2.0 max

2.5

－

500（T），1000（P）

500

2.5

Note : ※.LW Reverse type（□WK）

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

Multilayer Ceramic Capacitors

■PACKAGING

①Minimum Quantity

●Taped package

Thickness

Standard quantity [pcs]

Type(EIA)

0.2

code

C, D

P, T

Paper tape

Embossed tape

40000

□MK042(01005)

□MK063(0201)

－

0.3

15000

10000

20000

15000

□WK105(0204) ※

0.3

0.2

□MK105(0402)

0.3

－

0.5

10000

□VK105(0402) ※

□MK107(0603)

0.5

0.45

0.5

4000

－

□WK107(0306) ※

□MR107(0603)

4000

－

0.8

0.45

0.85

1.25

0.85

1.15

1.25

1.6

4000

□MK212(0805)

□WK212(0508)

□MR212(0805)

※

－

3000

－

4000

□MK316(1206)

□MR316(1206)

3000

－

0.85

1.15

1.5

2000

□MK325(1210)

□MR325(1210)

－

1.9

2.0max.

2.5

500（T）, 1000（P）

500

□MK432(1812)

2.5

Note : ※ LW Reverse type.

②Taping material

※No bottom tape for pressed carrier tape

●Card board carrier tape

●Embossed tape

Chip filled

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack01_j-02

③Representative taping dimensions

●Paper Tape（8mm wide）

●Pressed carrier tape（ 2mm pitch）

Chip Cavity

Insertion Pitch

Ｆ

Tape Thicknes

Type(EIA)

Ａ

Ｂ

Ｔ

□MK063(0201)

0.37

0.67

0.45max.

0.42max.

□WK105(0204) ※

□MK105(0402) （*1 C）

□MK105(0402) （*1 P）

2.0±0.05

0.65

1.15

0.4max.

0.3max.

0.42max.

Unit：mm

0.45max.

Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.

●Punched carrier tape （2mm pitch）

Chip Cavity

Type(EIA)

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Ａ

Ｂ

□MK105 (0402)

□VK105 (0402)

0.65

1.15

2.0±0.05

0.8max.

Unit：ｍｍ

●Punched carrier tape （4mm pitch）

Chip Cavity

Insertion Pich

Ｆ

Tape Thickness

Ｔ

Type(EIA)

Ａ

Ｂ

□MK107(0603)

□WK107(0306)

□MR107(0603)

□MK212(0805)

□WK212(0508)

□MK316(1206)

※

1.0

1.8

1.1max.

4.0±0.1

1.65

2.0

2.4

3.6

1.1max.

Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.

Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack01_j-02

●Embossed tape（4mm wide）

Chp Cavity

Insertion Pitch

Ｆ

Tape Thickness

Type(EIA)

Ａ

Ｂ

□MK042(01005)

0.23

0.43

1.0±0.02

0.5max.

0.25max.

Unit：mm

●Embossed tape（8mm wide）

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Type(EIA)

Ａ

Ｂ

□WK107(0306) ※

□MK212(0805)

1.0

1.8

1.3max.

0.25±0.1

1.65

2.0

2.4

3.6

□MR212(0805)

4.0±0.1

□MK316(1206)

3.4max.

0.6max.

□MR316(1206)

□MK325(1210)

2.8

□MR325(1210)

Note： ※ LW Reverse type.

Unit：mm

●Embossed tape（12mm wide）

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

□MK432(1812)

3.7

4.9

8.0±0.1

4.0max.

0.6max.

Unit：mm

④Trailer and Leader

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack01_j-02

⑤Reel size

φ178±2.0

φ50min.

φ13.0±0.2

φ21.0±0.8

2.0±0.5

1.0

4mm wide tape

8mm wide tape

12mm wide tape

1.5max.

2.5max.

5±1.0

10±1.5

14±1.5

Unit：mm

⑥Top Tape Strength

The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.

⑦Bulk Cassette

The exchange of individual specification is necessary.

Please contact Taiyo Yuden sales channels.

Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack01_j-02

Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and

High Reliability Application Multilayer Ceramic Capacitors are noted separately.

Multilayer Ceramic Capacitors

■RELIABILITY DATA

1.Operating Temperature Range

Standard

Temperature

－55 to ＋125℃

Compensating（Class1）

High Frequency Type

Specification

Temperature Range

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

－25 to ＋85℃

－30 to ＋85℃

X5R

X7R

X6S

X7S

X5R

Specified

Value

High Permittivity （Class2）

LD(※)

Y5V

Note: ※LD Low distortion high value multilayer ceramic capacitor

2. Storage Conditions

Temperature

Standard

－55 to ＋125℃

Compensating（Class1）

High Frequency Type

Specification

Temperature Range

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

－25 to ＋85℃

－30 to ＋85℃

X5R

X7R

X6S

X7S

X5R

Specified

Value

High Permittivity （Class2）

LD(※)

Y5V

Note: ※LD Low distortion high value multilayer ceramic capacitor

3. Rated Voltage

Standard

50VDC, 25VDC, 16VDC

Temperature

Specified

Value

Compensating（Class1）

High Frequency Type 50VDC, 16VDC

50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC

High Permittivity （Class2）

4. Withstanding Voltage （Between terminals）

Temperature

Specified

Standard

Compensating（Class1）

High Frequency Type No breakdown or damage

Value

High Permittivity （Class2）

Class 1

Class 2

Rated voltage×2.5

Test

Applied voltage

Methods and

Duration

Rated volta×3

1 to 5 sec.

50mA max.

Remarks

Charge/discharge current

5. Insulation Resistance

Temperature

Standard

High Frequency Type

10000 MΩ min.

Compensating（Class1）

Specified

Value

C≦0.047μF : 10000 MΩ min.

C＞0.047μF : 500MΩ・μF

High Permittivity （Class2） Note 1

Test

Applied voltage

Duration

: Rated voltage

Methods and

Remarks

: 60±5 sec.

: 50mA max.

Charge/discharge current

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-01

6. Capacitance （Tolerance）

Temperature

0.2pF≦C≦5pF

0.2pF≦C≦10pF

C＞10pF

: ±0.25pF

C□

U□

Standard

: ±0.5pF

: ±5% or ±10%

Compensating（Class1）

Specified

Value

0.3pF≦C≦2pF

C＞2pF

: ±0.1pF

: ±5%

High Frequency Type

BJ, B7, C6, C7, LD(※) : ±10% or ±20%,

F : ＋80/－20%

High Permittivity （Class2）

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

High Frequency Type

Class 2

Standard

C≦10μF

C＞10μF

Test

Preconditioning

None

Thermal treatment （at 150℃ for 1hr） Note 2

Methods and

Remarks

Measuring frequency

Measuring voltage Note

Bias application

1ＭHz±10%

0.5 to 5Vrms

1kHz±10%

1±0.2Vrms

120±10Hz

0.5±0.1rms

one

7. Q or Dissipation Factor

C＜30pF : Q≧400＋20C

C≧30pF : Q≧1000

Standard

Temperature

Compensating（Class1）

（C：Nominal capacitance）

Specified

Value

High Frequency Type Refer to detailed specification

High Permittivity （Class2） Note 1

BJ, B7, C6, C7：2.5% max., F：7% max.

Class 1

Class 2

Standard

High Frequency Type

C≦10μF

C＞10μF

Preconditioning

None

Thermal treatment （at 150℃ for 1hr） Note 2

Test

Measuring frequey

Measuring voltage Note 1

Bias application

1ＭHz±10%

1GHz

1ｋHz±10%

1±0.2Vrms

120±10Hz

Methods and

Remarks

0.5 to 5Vrms

0.5±0.1Vrms

None

High Frequency Type

Measuring equipment

Measuring jig

: HP4291A

: HP16192A

8. Temperature Characteristic （Without voltage application）

Temperature Characteristic ［ppm/℃］

Tolerance ［ppm/℃］

C□ :

CH, CJ, CK

H : ±60

J : ±120

K : ±250

Standard

U□ : －750

UJ, UK

Temperature

SL : ＋350 to －1000

Compensating（Class1）

Temperature Characteristic ［ppm/℃］

Tolerance ［ppm/℃］

H : ±60

High Frequency Type

C□ :

R□ : －220

Capacitance

change

Reference

Specified

Value

Specification

Temperature Range

temperature

20℃

±10%

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

－25 to ＋85℃

－30 to ＋85℃

X5R

X7R

X6S

X7S

X5R

±15%

25℃

±15%

25℃

High Permittivity （Class2）

±22%

25℃

±22%

25℃

LD(※)

±15%

25℃

＋30/－80%

＋22/－82%

20℃

Y5V

25℃

Note : ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

following equation.

（C₈₅－C₂₀）

×10⁶（ppm/℃）

C₂₀×△T

△T＝65

Test

Class 2

Methods and

Remarks

Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following

equation.

Step

B、F

X5R、X7R、X6S、X7S、Y5V

Minimum operating temperature

20℃

25℃

Maximum operating temperature

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-01

（C－C₂）

C₂

×100（%）

：Capacitance in Step 1 or Step 3

C2 ：Capacitance in Step 2

9. Deflection

Appearance

: No abnormality

Standard

Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.

Temperature

Compensating（Class1）

Appearance

: No abnormality

: Within±0.5 pF

High Frequency Type

Specified

Value

Cpaitance change

Appearance

: No abnormality

Capacitance change : Within ±12.5%（BJ, B7, C6, C7,LD(※)）

Within ±30%（F）

High Permittivity （Class2）

Note: ※LD Low distortion high value multilayer ceramic capacitor

Multilayer Ceramic Capacitors

042, 063, ^※105 Type

The other types

Board

Glass epoxy-resin substrate

Test

Thickness

Warp

0.8mm

1.6mm

Methods and

Remarks

1mm

Duration

10 sec.

^※105 Type thickness, C： 0.2mm ,P： 0.3mm.

Capacitance measurement shall be conducted

with the board bent

10. Body Strength

Standard

－

Temperature

Specified

Value

Compensating（Class1）

High Frequency Type No mechanical damage.

－

High Permittivity （Class2）

High Frequency Type

Applied force

Duration

: 5N

Test

: 10 sec.

Methods and

Remarks

11. Adhesive Strength of Terminal Electrodes

Temperature

Standard

Specified

Compensating（Class1）

High Frequency Type No terminal separation or its indication.

Value

High Permittivity （Class2）

Multilayer Ceramic Capacitors

042, 063 Type

105 Type or more

Test

Methods and

Remarks

Applied force

Duration

30±5 sec.

12. Solderability

Standard

High Frequency Type At least 95% of terminal electrode is covered by new solder.

Temperature

Specified

Value

Compensating（Class1）

High Permittivity （Class2）

Eutectic solder

H60A or H63A

230±5℃

Lead-free solder

Sn-3.0Ag-0.5Cu

245±3℃

Test

Solder type

Methods and

Remarks

Solder temperature

Duration

4±1 sec.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-01

13. Resistance to Soldering

Appearance

: No abnormlty

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.

: Initial value

Standard

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitancecange

: Within ±2.5%

: Initial value

High Frequency Type

Specified

Value

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Appearance

: No abnormality

Capactace change

: Within ±7.5%（BJ, B7, C6, C7, LD(※)）

Within ±20%（F）

High Permittivity （Class2） Note 1

Dissipation factor

: Initial value

Insulation resistance

Withstanding voltage

: Initial value

（between terminals）: No abnormality

Note: ※LD Low distortion high value multilayer ceramic capacitor

lss 1

042, 063 Type

105 Type

Preconditioning

Preheating

None

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5 min.

270±5℃

150℃, 1 to 2 min.

Solder temp.

Duration

3±0.5 sec.

Recovery

6 to 24 hrs （Standard condition） Noe 5

Test

Methods and

Remarks

Class 2

105, 107, 212 Type

042、063 Type

316, 325 Type

Preconditioning

Preheating

Thermal treatment （at 150℃ for 1 hr） Note 2

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5 min.

270±5℃

80 to 100℃, 5 to 10 min.

150 to 200℃, 5 to 10 min.

150℃, 1 to 2 min.

Solder temp.

Duration

3±0.5 sec.

Recovery

24±2 hrs （Standard condition） Note 5

14. Temperature Cycle (Thermal Shock）

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.

: Initial value

Standard

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: Within ±0.25pF

: Initial value

High Frequency Type

Specified

Value

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Appearance

: No abnormality

Capacitance change

: Within ±7.5% （BJ, B7, C6, C7, LD(※)）

Within ±20% （F）

High Permittivity （Class2） Note 1

Dissipation factor

: Initial value

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

None

Class 2

Thermal treatment （at 150℃ for 1 hr）

Note 2

Preconditioning

Step

Temperature（℃）

Time（min.）

Test

Minimum operating temperature

Normal temperature

30±3

2 to 3

30±3

2 to 3

Methods and

Remarks

1 cycle

Maximum operating temperature

Normal temperature

Number of cycles

Recovery

5 times

6 to 24 hrs （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-01

15. Humidity （Steady State）

Appearance

: No abnormality

Capacitance change

: Within ±5% or ±0.5pF, whichever is larger.

: C＜10pF : Q≧200＋10C

Standard

10≦C＜30pF : Q≧275＋2.5C

C≧30pF:Q≧350（C：Nominal capacitance）

: 1000 MΩ min.

Temperature

Compensating（Class1）

Insulation resistance

Appearance

: No abnormality

: Within ±0.5pF,

: 1000 MΩ min.

Specified

Value

High Frequency Type Capacitance change

Insulation resistance

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, LD(※)）

Within ±30% （F）

High Permittivity （Class2） Note 1

Dissipation factor

: 5.0% max.（BJ, B7, C6, C7, LD(※)）

11.0% max.（F）

Insulation resistance

: 50 MΩμF or 1000 MΩ whichever is smaller.

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Class 2

All items

Standard

40±2℃

High Frequency Type

60±2℃

Preconditioning

Temperature

Humidity

None

Thermal treatment（ at 150℃ for 1 hr） Note 2

40±2℃

Test

Methods and

Remarks

90 to 95%RH

Duration

500＋24/－0 hrs

Recovery

6 to 24 hrs （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

16. Humidity Loading

Appearance

: No abnormality

Capacitance change

: Within ±7.5% or ±0.75pF, whichever is larger.

: C＜30pF：Q≧100＋10C/3

Standard

C≧30pF：Q≧200 （C：Nominal capacitance）

: 500 MΩ min.

Insulation resistance

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: C≦2pF：Within ±0.4 pF

C＞2pF：Within ±0.75 pF

（C：Nominal capacitance）

: 500 MΩ min.

High Frequency Type

Specified

Value

Insulation resistance

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, LD(※)）

Within ±30% （F）

High Permittivity （Class2） Note 1

Dissipation factor

: 5.0% max. （BJ, B7, C6, C7, LD(※)）

11.0% max. （F）

Insulation resistance

: 25 MΩμF or 500 MΩ, whichever is smaller.

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Class 2

Standard

High Frequency Type

All items

Preconditioning

Voltage treatment

None

（Rated voltage are applied for 1 hour at 40℃） Note 3

Temperature

Humidity

40±2℃

60±2℃

40±2℃

Test

Methods and

Remarks

90 to 95%RH

500＋24/－0 hrs

Rated voltage

90 to 95%RH

Duration

500＋24/－0 hrs

Rated voltage

Applied voltage

Charge/discharge

current

50mA max.

Recovery

6 to 24 hrs （Standard condition） Note 5

24±2 hrs（Standard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-01

17. High Temperature Loading

Appearance

: No abnormality

Capacitance change

: Within ±3% or ±0.3pF, whichever is larger.

: C＜10pF： Q≧200＋10C

Standard

10≦C＜30pF：Q≧275＋2.5C

C≧30pF： Q≧350（C：Nominal capacitance）

: 1000 MΩ min.

Temperature

Compensating（Class1）

Insulation resistance

Appearance

: No abnormality

Specified

Value

High Frequency Type Capacitance change

Insulation resistance

: Within ±3% or ±0.3pF, whichever is larger.

: 1000 MΩ min.

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, LD(※)）

Within ±30% （F）

High Permittivity （Class2） Note 1

Dissipation factor

: 5.0% max.（BJ, B7, C6, C7, LD(※)）

11.0% max.（F）

Insulation resistance

: 50 MΩμF or 1000 MΩ, whichever is smaller.

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

High Frequency Type

Class 2

Standard

BJ, LD(※), F

B7, C7

Voltage treatment（Twice the rated voltage shall be applied for

1 hour at 85℃, 105℃ or 125℃） Note 3, 4

Maximum operating temperature

Preconditioning

None

Temperature

Duration

Maximum operating temperature

1000＋48/－0 hrs

Test

1000＋48/－0 hrs

Methods and

Remarks

Applied voltage

Charge/discharge

current

Rated voltage×2

Rated voltage×2 Note 4

50mA max.

Recovery

6 to 24hr （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

Note: ※LD Low distortion high value multilayer ceramic capacitor

Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.

Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for

24±2hours.

Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in

the test conditions, and kept at room temperature for 24±2hours.

Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.

Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning

measurement results, in order to provide correlation data, the test shall be conducted under the following condition.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the

"standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-01

High Reliability Application Multilayer Ceramic Capacitors are noted separately.

Precautions on the use of Multilayer Ceramic Capacitors

■PRECAUTIONS

1. Circuit Design

◆Verification of operating environment, electrical rating and performance

1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have

severe social ramifications.

Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from

them used in general purpose applications.

Precautions

◆Operating Voltage （Verification of Rated voltage）

1. The operating voltage for capacitors must always be their rated voltage or less.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.

For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.

2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC

voltage or a pulse voltage having rapid rise time is used in a circuit.

2. PCB Design

◆Pattern configurations （Design of Land-patterns）

1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.

Therefore, the following items must be carefully considered in the design of land patterns:

（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider

appropriate land-patterns for proper amount of solder.

Precautions

（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by

solder-resist.

◆Pattern configurations （Capacitor layout on PCBs）

After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB

cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land

pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.

◆Pattern configurations （Design of Land-patterns）

The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.

（1）Recommended land dimensions for typical chip capacitors

●Multilayer Ceramic Capacitors : Recommended land dimensions

Land patterns for PCBs

（unit: mm）

Wave-soldering

Type

107

1.6

212

2.0

316

3.2

325

3.2

Size

0.8

1.25

1.6

2.5

0.8 to 1.0

0.5 to 0.8

0.6 to 0.8

1.0 to 1.4

0.8 to 1.5

0.9 to 1.2

1.8 to 2.5

0.8 to 1.7

1.2 to 1.6

1.8 to 2.5

0.8 to 1.7

1.8 to 2.5

Reflow-soldering

Type 042

063

0.6

105

1.0

107

1.6

0.8

212

2.0

316

3.2

325

3.2

432

Technical

0.4

4.5

Size

considerations

0.2

0.3

0.5

1.25

1.6

2.5

3.2

0.15 to 0.25

0.15 to 0.20

0.15 to 0.30

0.20 to 0.30

0.25 to 0.40

0.45 to 0.55

0.40 to 0.50

0.45 to 0.55

0.8 to 1.0

0.8 to 1.2

0.9 to 1.6

1.8 to 2.5

1.0 to 1.5

1.2 to 2.0

1.8 to 2.5

1.0 to 1.5

1.8 to 3.2

2.5 to 3.5

1.5 to 1.8

2.3 to 3.5

0.6 to 0.8

Note：Recommended land size might be different according to the allowance of the size of the product.

●LWDC: Recommended land dimensions for reflow-soldering

（unit: mm）

Type

105

0.52

107

0.8

212

1.25

Size

1.0

1.6

2.0

0.18 to 0.22

0.2 to 0.25

0.9 to 1.1

0.25 to 0.3

0.3 to 0.4

1.5 to 1.7

0.5 to 0.7

0.4 to 0.5

1.9 to 2.1

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

（2）Examples of good and bad solder application

Items

Not eommended

Recommended

Mixed mounting of SMD and

leaded components

Component placement close to

the chassis

Hand-soldering of leaded

Components near mounted

components

Horizontal component

placement

◆Pattern configurations （Capacitor layout on PCBs）

1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any

stresses from board warp or deflection.

possible mechanical

Items

Not recommended

Recommended

Place the product at a right

angle to the direction of the

anticipated mechanical

stress.

Deflection of board

1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.

1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods

are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,

split methods as well as chip location.

3. Mounting

Precautions

◆Adjustment of mounting machine

1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.

2. Maintenance and inspection of mounting machines shall be conducted periodically.

◆Selection of Adhesives

1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the

following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and

hardening period. Therefore, please contact us for further information.

◆Adjustment of mounting machine

1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid

this, the following points shall be considerable.

Technical

（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.

（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.

considerations

（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be

used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle

placement:

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

Items

Not recommended

Recommended

Single-sided mounting

Double-sided mounting

2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical

impact on the capacitors.

To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of

the pin shall be conducted periodically.

◆Selection of Adhesives

Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in

stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect

components. Therefore, the following precautions shall be noted in the application of adhesives.

（1）Required adhesive characteristics

a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.

b. The adhesive shall have sufficient strength at high temperatures.

c. The adhesive shall have good coating and thickness consistency.

d. The adhesive shall be used during its prescribed shelf life.

e. The adhesive shall harden rapidly.

f. The adhesive shall have corrosion resistance.

g. The adhesive shall have excellent insulation characteristics.

h. The adhesive shall have no emission of toxic gasses and no effect on the human body.

（2）The recommended amount of adhesives is as follows;

［Recommended condition］

Amount adhesive

After capacitors are bonded

Figure

212/316 case sizes as examples

0.3mm min

100 to 120μm

Adhesives shall not contact land

4. Soldering

◆Selection of Flux

Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;

（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall

not be applied.

（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.

（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.

Precautions

◆Soldering

Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.

Sn-Zn solder paste can adversely affect MLCC reliability.

Please contact us prior to usage of Sn-Zn solder.

◆Selection of Flux

1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to

corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.

1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted

and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.

1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high

humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning

methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.

Technical

considerations

◆Soldering

･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.

･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal

shock.

･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within

100 to 130℃.

･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

［Reflow soldering］

【Recommended conditions for eutectic

soldering】

【Recommended condition for Pb-free

soldering】

Caution

①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the

thickness of a capacitor.

②Because excessive dwell times can adversely affect solderability, soldering duration shall

be kept as close to recommended times as possible.

［Wave soldering］

【Recommended conditions for eutectic

soldering】

【Recommended condition for Pb-free

soldering】

Caution

①Wave soldering must not be applied to capacitors designated as for reflow soldering only.

［Hand soldering］

【Recommended conditions for eutectic

soldering】

【Recommended condition for Pb-free

soldering】

⊿T

325type or more

⊿T≦130℃

316type or less

⊿T≦150℃

Caution

①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.

②The soldering iron shall not directly touch capacitors.

5. Cleaning

Precautions

◆Cleaning conditions

1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use

of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）

2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect

capacitor's characteristics.

1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate

their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.

2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of

In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead

the capacitors.

to the

Technical

cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall

be carefully checked;

considerations

Ultrasonic output :

20 W/ℓ or less

40 kHz or less

Ultrasonic frequency :

Ultrasonic washing period : 5 min. or less

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

6. Resin coating and mold

1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the

while left under normal storage conditions resulting in the deterioration of the capacitor's performance.

hardening period or

Precautions

2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat

may lead to damage or destruction of capacitors.

The use of such resins, molding materials etc. is not recommended.

7. Handling

◆Splitting of PCB

1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.

2. Board separation shall not be done manually, but by using the appropriate devices.

Precautions

◆Mechanical considerations

Be careful not to subject capacitors to excessive mechanical shocks.

（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.

（2）Please be careful that the mounted components do not come in contact with or bump against other boards or

components.

8. Storage conditions

◆Storage

1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control

temperature and humidity in the storage area. Humidity should especially be kept as low as possible.

・Recommended conditions

Ambient temperature : Below 30℃

Humidity

: Below 70% RH

Precautions

The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as

time passes, so capacitors shall be used within 6 months from the time of delivery.

・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.

2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so

care shall be

taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at

150℃ for 1hour.

If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and

quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the

above period, please check solderability before using the capacitors.

Technical

considerations

※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.

Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

MK107 [TAIYO YUDEN]

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